5962-9317701MUX
vs
IDT7206S80P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
80 ns
Cycle Time
65 ns
100 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
Memory Density
147456 bit
147456 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX9
16KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Rohs Code
Additional Feature
RETRANSMIT
Clock Frequency-Max (fCLK)
10 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.008 A
Supply Current-Max
0.12 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
20
Compare 5962-9317701MUX with alternatives
Compare IDT7206S80P with alternatives