5962-9315707HXC
vs
MSM8256SL-35
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MERCURY SYSTEMS INC
APTA GROUP INC
Package Description
,
DIP, DIP32,.6
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
BATTERY BACK-UP OPERATION
JESD-30 Code
R-CDIP-T32
R-XDIP-T32
JESD-609 Code
e4
e0
Memory Density
2097152 bit
2097152 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256KX8
256KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class B (Modified)
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HYBRID
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Standby Current-Max
0.0006 A
Standby Voltage-Min
2 V
Supply Current-Max
0.24 mA
Terminal Pitch
2.54 mm
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