5962-9309104HXX
vs
5962-9309104HXA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MERCURY SYSTEMS INC
MERCURY SYSTEMS INC
Package Description
DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
DIP,
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
200 ns
200 ns
Additional Feature
AUTOMATIC WRITE
JESD-30 Code
R-CDIP-T32
R-XDIP-T32
Length
42.4 mm
42.415 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
EEPROM MODULE
EEPROM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Qualified
Screening Level
MIL-STD-883
MIL-PRF-38534 Class H
Seated Height-Max
6.98 mm
6.99 mm
Supply Current-Max
0.1 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
3
3
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