5962-9161706QZX
vs
IDT70V25L55PFI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
1.150 X 1.150 INCH, MQFP-84
TQFP-100
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
55 ns
JESD-30 Code
S-XQFP-F84
S-PQFP-G100
Length
29.21 mm
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
84
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX16
8KX16
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
QFF
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
2.89 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
29.21 mm
14 mm
Base Number Matches
5
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
100
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.005 A
Standby Voltage-Min
3 V
Supply Current-Max
0.17 mA
Terminal Finish
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s)
20
Compare 5962-9161706QZX with alternatives
Compare IDT70V25L55PFI with alternatives