5962-9159303MYA
vs
MT5C6404C-20/IT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
AUSTIN SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP22,.3
Pin Count
22
22
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Access Time-Max
20 ns
Additional Feature
BATTERY BACKUP; LOW POWER STANDBY
I/O Type
COMMON
JESD-30 Code
R-CDIP-T22
Length
29.337 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Functions
1
Number of Ports
1
Number of Terminals
22
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
16KX4
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Compare 5962-9159303MYA with alternatives
Compare MT5C6404C-20/IT with alternatives