5962-9159303MYA
vs
L7C164CMB10
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
LOGIC DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP22,.3
Pin Count
22
22
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
10 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
JESD-30 Code
R-GDIP-T22
JESD-609 Code
e0
Length
27.178 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
1
Number of Terminals
22
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX4
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.00025 A
Standby Voltage-Min
2 V
Supply Current-Max
0.17 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Compare 5962-9159303MYA with alternatives
Compare L7C164CMB10 with alternatives