5962-9080306MLA
vs
WS57C49B-45DMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
WAFERSCALE INTEGRATION INC
Package Description
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
45 ns
45 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
1
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP24,.6
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.035 A
Supply Current-Max
0.107 mA
Compare 5962-9080306MLA with alternatives
Compare WS57C49B-45DMB with alternatives