5962-9080304MLX vs AT27HC642R-70DM feature comparison

5962-9080304MLX QP Semiconductor

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AT27HC642R-70DM Atmel Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC ATMEL CORP
Part Package Code DIP DIP
Package Description DIP, WDIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Access Time-Max 70 ns
I/O Type COMMON
JESD-609 Code e0
Length 32 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.05 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-9080304MLX with alternatives

Compare AT27HC642R-70DM with alternatives