5962-9080304MLX by:

OTP ROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24

Part Details for 5962-9080304MLX by QP Semiconductor

Overview of 5962-9080304MLX by QP Semiconductor

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Applications Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Part Details for 5962-9080304MLX

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5962-9080304MLX Part Data Attributes:

5962-9080304MLX QP Semiconductor
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5962-9080304MLX QP Semiconductor OTP ROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERDIP-24
Part Life Cycle Code Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-GDIP-T24
Memory Density 65536 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-9080304MLX

This table gives cross-reference parts and alternative options found for 5962-9080304MLX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9080304MLX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS57C49B-45DMB UVPROM, 8KX8, 45ns, CMOS, CDIP24, Waferscale Integration Inc 5962-9080304MLX vs WS57C49B-45DMB
TMS27C49-5JL 8KX8 UVPROM, 55ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments 5962-9080304MLX vs TMS27C49-5JL
X88C64D EEPROM, 8KX8, 120ns, Parallel, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24 Xicor Inc 5962-9080304MLX vs X88C64D
CY7C261-35WMB UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor 5962-9080304MLX vs CY7C261-35WMB
S63364C-P MASK ROM, 8KX8, 120ns, CMOS, PDIP24 Gould Ami 5962-9080304MLX vs S63364C-P
H1264B-55Y[PWRDOWN] MASK ROM, 8KX8, 55ns, CMOS, CDIP24 Hughes Aircraft 5962-9080304MLX vs H1264B-55Y[PWRDOWN]
27HC641-70/J 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc 5962-9080304MLX vs 27HC641-70/J
WS57C49B-45D UVPROM, 8KX8, 45ns, CMOS, CDIP24, Waferscale Integration Inc 5962-9080304MLX vs WS57C49B-45D
AM27C49-35DC UVPROM, 8KX8, 35ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 AMD 5962-9080304MLX vs AM27C49-35DC
PY26325WC UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Pyramid Semiconductor Corporation 5962-9080304MLX vs PY26325WC

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