5962-9076502VEX
vs
DS26LS31CMX/NOPB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP,
|
LEAD FREE, SOIC-16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-485
|
EIA-422; FED STD 1020
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmit Delay-Max |
25 ns
|
15 ns
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| High Level Input Current-Max |
|
0.00002 A
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Out Swing-Min |
|
2 V
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
SOP16,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
|
1.75 mm
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
|
|
|
Compare 5962-9076502VEX with alternatives
Compare DS26LS31CMX/NOPB with alternatives