5962-9067801MXC
vs
QA80186-10
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEL CORP
Package Description
PGA,
PGA, PGA68,11X11
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
24
20
Boundary Scan
NO
NO
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CPGA-P68
S-CPGA-P68
Low Power Mode
YES
NO
Number of Terminals
68
68
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Screening Level
MIL-STD-883
Speed
10 MHz
10 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
1
Rohs Code
Part Package Code
PGA
Pin Count
68
Bit Size
16
Clock Frequency-Max
10 MHz
JESD-609 Code
e0
Length
29.46 mm
Package Equivalence Code
PGA68,11X11
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Qualification Status
Not Qualified
Seated Height-Max
4.57 mm
Supply Current-Max
550 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
29.46 mm
Compare QA80186-10 with alternatives