5962-8986306XX
vs
IDT7201LA30DGB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
DIP,
DIP, DIP28,.6
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
35 ns
40 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Length
37.338 mm
37.211 mm
Memory Density
4608 bit
4608 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
28
JESD-609 Code
e3
Memory IC Type
OTHER FIFO
Package Equivalence Code
DIP28,.6
Screening Level
MIL-STD-883 Class B
Standby Current-Max
0.015 A
Supply Current-Max
0.1 mA
Terminal Finish
MATTE TIN
Compare 5962-8986306XX with alternatives
Compare IDT7201LA30DGB with alternatives