5962-8986306XX
vs
7201LA30TDB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
DIP,
CERAMIC, DIP-28
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
35 ns
40 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Length
37.338 mm
37.1475 mm
Memory Density
4608 bit
4608 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.62 mm
Base Number Matches
3
2
Pbfree Code
Rohs Code
Part Package Code
CDIP
Pin Count
28
Manufacturer Package Code
SD28
Date Of Intro
1988-01-01
Clock Frequency-Max (fCLK)
25 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
1
Package Equivalence Code
DIP28,.3
Peak Reflow Temperature (Cel)
240
Screening Level
MIL-STD-883 Class B
Standby Current-Max
0.0009 A
Supply Current-Max
0.14 mA
Terminal Finish
TIN LEAD
Compare 5962-8986306XX with alternatives
Compare 7201LA30TDB with alternatives