Findchips: Compare 5962-8986305YX vs IDT7201LA30DBG

5962-8986305YX vs IDT7201LA30DBG feature comparison

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Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	DIP	DIP
Package Description	DIP,	DIP,
Pin Count	28	28
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.71	8542.32.00.71
Access Time-Max	30 ns	30 ns
Cycle Time	40 ns	40 ns
JESD-30 Code	R-XDIP-T28	R-GDIP-T28
Memory Density	4608 bit	4608 bit
Memory Width	9	9
Number of Functions	1	1
Number of Terminals	28	28
Number of Words	512 words	512 words
Number of Words Code	512	512
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	512X9	512X9
Output Enable	NO	NO
Package Body Material	UNSPECIFIED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Base Number Matches	6	1
Pbfree Code		Yes
Rohs Code		Yes
Additional Feature		RETRANSMIT
JESD-609 Code		e3
Length		37.211 mm
Memory IC Type		OTHER FIFO
Output Characteristics		3-STATE
Screening Level		MIL-STD-883 Class B
Seated Height-Max		5.08 mm
Supply Current-Max		0.1 mA
Terminal Finish		MATTE TIN
Terminal Pitch		2.54 mm
Width		15.24 mm
	Memory » FIFOs	Memory » FIFOs