IDT7201LA30DBG
vs
5962-8986305YC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
30 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
40 ns
40 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
JESD-609 Code
e3
e0
Length
37.211 mm
37.0205 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.1 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.62 mm
Base Number Matches
1
2
Compare IDT7201LA30DBG with alternatives
Compare 5962-8986305YC with alternatives