5962-8984110LX
vs
TIBPAL20R8-10MWB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DFP
Package Description
DIP,
DFP, FL24,.35
Pin Count
24
24
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
30.3 MHz
50 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
Number of Dedicated Inputs
11
12
Number of I/O Lines
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
12 DEDICATED INPUTS, 0 I/O
Output Function
MACROCELL
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
FLASH PLD
OT PLD
Propagation Delay
25 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Architecture
PAL-TYPE
Length
14.355 mm
Number of Inputs
12
Number of Outputs
8
Number of Product Terms
64
Package Equivalence Code
FL24,.35
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
2.29 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9.085 mm
Compare 5962-8984110LX with alternatives
Compare TIBPAL20R8-10MWB with alternatives