Findchips: Compare 5962-8984105LA vs 5962-8984105LC

5962-8984105LA vs 5962-8984105LC feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	CYPRESS SEMICONDUCTOR CORP
Part Package Code	DIP
Package Description	DIP,	DIP,
Pin Count	24
Reach Compliance Code	unknown	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	42 MHz	83 MHz
JESD-30 Code	R-GDIP-T24	R-GDIP-T24
JESD-609 Code	e0	e4
Number of Dedicated Inputs	11	11
Number of I/O Lines	10	10
Number of Terminals	24	24
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O
Output Function	MACROCELL	MACROCELL
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Equivalence Code	DIP24,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Programmable Logic Type	EE PLD	FLASH PLD
Propagation Delay	15 ns	10 ns
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-STD-883
Seated Height-Max	5.08 mm	5.08 mm
Supply Voltage-Max	5.5 V	5.5 V
Supply Voltage-Min	4.5 V	4.5 V
Supply Voltage-Nom	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	TIN LEAD	GOLD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	7.62 mm
Base Number Matches	9	4
Additional Feature		10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
Length		32 mm
	Programmable Logic » Programmable Logic Devices	Programmable Logic » Programmable Logic Devices