5962-8984105LA vs 5962-8984105LX feature comparison

5962-8984105LA NXP Semiconductors

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5962-8984105LX Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 42 MHz 42 MHz
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 9 8
Additional Feature PAL WITH MACROCELLS; 10 MACROCELLS
Length 31.9405 mm

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