5962-8984102LA
vs
5962-89841023A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
QLCC
Package Description
DIP,
CERAMIC, LCC-28
Pin Count
24
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
31.2 MHz
31.2 MHz
JESD-30 Code
R-GDIP-T24
S-CQCC-N28
JESD-609 Code
e0
e0
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Position
DUAL
QUAD
Base Number Matches
7
7
Rohs Code
Architecture
PAL-TYPE
Length
11.43 mm
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Package Equivalence Code
LCC28,.45SQ
Screening Level
MIL-STD-883
Seated Height-Max
2.54 mm
Terminal Pitch
1.27 mm
Width
11.43 mm
Compare 5962-8984102LA with alternatives
Compare 5962-89841023A with alternatives