5962-8984101LA
vs
5962-89841073A
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
Package Description
CERAMIC, DIP-24
QCCN, LCC28,.45SQ
Pin Count
24
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
22 MHz
30.3 MHz
JESD-30 Code
R-GDIP-T24
S-CQCC-N28
JESD-609 Code
e0
e0
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
22
Number of Outputs
10
10
Number of Product Terms
132
132
Number of Terminals
24
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP24,.3
LCC28,.45SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Programmable Logic Type
EE PLD
FLASH PLD
Propagation Delay
30 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535; MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
7
3
Additional Feature
CORRECT SUBGROUP EEPLD
Length
11.43 mm
Seated Height-Max
2.54 mm
Width
11.43 mm
Compare 5962-8984101LA with alternatives
Compare 5962-89841073A with alternatives