5962-8976407MZA
vs
5962-8687515XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Part Package Code
QFP
Package Description
QFF, QFL48,.75SQ
CERAMIC, DIP-48
Pin Count
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
35 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-XQFP-F48
R-GDIP-T48
JESD-609 Code
e0
Memory Density
32768 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
48
48
Number of Words
4096 words
1024 words
Number of Words Code
4000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
QFF
DIP
Package Equivalence Code
QFL48,.75SQ
DIP48,.6
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
2.74 mm
Standby Current-Max
0.03 A
0.004 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.3 mA
0.185 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
1
3
Compare 5962-8976407MZA with alternatives
Compare 5962-8687515XX with alternatives