5962-8687515XX
vs
7140LA55CGI8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
CERAMIC, DIP-48
DIP, DIP48,.6
Reach Compliance Code
unknown
compliant
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T48
R-XDIP-T48
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
Number of Ports
2
2
Number of Terminals
48
48
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP48,.6
DIP48,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.004 A
0.004 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.185 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.41
JESD-609 Code
e3
Terminal Finish
MATTE TIN
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Compare 7140LA55CGI8 with alternatives