5962-8969402EC
vs
N82S25F
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SRI INTERNATIONAL
|
SIGNETICS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
30 ns
|
50 ns
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Memory Density |
64 bit
|
64 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
16 words
|
16 words
|
| Number of Words Code |
16
|
16
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
16X4
|
16X4
|
| Output Characteristics |
3-STATE
|
OPEN-COLLECTOR
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Standby Current-Max |
0.07 A
|
|
| Supply Current-Max |
0.07 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| Number of Ports |
|
1
|
| Output Enable |
|
NO
|
|
|
|
Compare 5962-8969402EC with alternatives
Compare N82S25F with alternatives