5962-8959834MXA vs AS7C31024B-20STC feature comparison

5962-8959834MXA Microsemi Corporation

Buy Now Datasheet

AS7C31024B-20STC Alliance Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ALLIANCE SEMICONDUCTOR CORP
Part Package Code DIP TSOP1
Package Description DIP, TSOP1, TSSOP32,.56,20
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 20 ns
JESD-30 Code R-GDIP-T32 R-PDSO-G32
Length 40.64 mm 11.8 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.937 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 8 mm
Base Number Matches 1 2
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code TSSOP32,.56,20
Standby Voltage-Min 3 V
Supply Current-Max 0.055 mA
Terminal Finish TIN LEAD

Compare 5962-8959834MXA with alternatives

Compare AS7C31024B-20STC with alternatives