5962-8953402MXX
vs
TS68882VF20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
TELEDYNE E2V (UK) LTD
Part Package Code
PGA
QFP
Package Description
PGA,
CERAMIC, QFP-68
Pin Count
68
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
5
Boundary Scan
NO
NO
Clock Frequency-Max
20 MHz
20 MHz
External Data Bus Width
32
32
JESD-30 Code
S-CPGA-P68
S-CQFP-G68
Number of Terminals
68
68
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
GULL WING
Terminal Position
PERPENDICULAR
QUAD
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
5
Rohs Code
Length
24.13 mm
Package Equivalence Code
QFP68,1.1SQ,50
Seated Height-Max
3.43 mm
Supply Current-Max
136 mA
Terminal Pitch
1.27 mm
Width
24.13 mm
Compare 5962-8953402MXX with alternatives
Compare TS68882VF20 with alternatives