5962-8952301EX
vs
L8C403CC25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
LOGIC DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
15 ns
Cycle Time
100 ns
25 ns
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Length
20.066 mm
20.32 mm
Memory Density
256 bit
2304 bit
Memory Width
4
9
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
64 words
64 words
Number of Words Code
64
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
64X4
256X9
Output Enable
YES
NO
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Rohs Code
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
225
Supply Current-Max
0.08 mA
Compare 5962-8952301EX with alternatives
Compare L8C403CC25 with alternatives