L8C403CC25
vs
CY7C401-25DC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, CERDIP-16
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
34 ns
Cycle Time
25 ns
40 ns
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Length
20.32 mm
19.431 mm
Memory Density
2304 bit
256 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
4
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
64 words
64 words
Number of Words Code
256
64
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X9
64X4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.08 mA
0.075 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Additional Feature
BUBBLE BACK 50NS
Clock Frequency-Max (fCLK)
25 MHz
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Standby Current-Max
0.075 A
Terminal Finish
TIN LEAD
Compare L8C403CC25 with alternatives
Compare CY7C401-25DC with alternatives