5962-8946203MYC vs HD68000P-8 feature comparison

5962-8946203MYC Atmel Corporation

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HD68000P-8 Hitachi Ltd

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP HITACHI LTD
Part Package Code DIP DIP
Package Description DIP, DIP64,.9 DIP, DIP64,.9
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 24
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 12.5 MHz 8 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T64 R-PDIP-T64
JESD-609 Code e4 e0
Low Power Mode NO YES
Number of Terminals 64 64
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP64,.9 DIP64,.9
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Speed 12.5 MHz 8 MHz
Supply Current-Max 45 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Gold (Au) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Length 82.042 mm
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0
Seated Height-Max 5.08 mm
Width 22.86 mm

Compare 5962-8946203MYC with alternatives

Compare HD68000P-8 with alternatives