5962-8946203MYC
vs
HD68000P-8
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
HITACHI LTD
Part Package Code
DIP
DIP
Package Description
DIP, DIP64,.9
DIP, DIP64,.9
Pin Count
64
64
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
23
24
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
12.5 MHz
8 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T64
R-PDIP-T64
JESD-609 Code
e4
e0
Low Power Mode
NO
YES
Number of Terminals
64
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP64,.9
DIP64,.9
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Speed
12.5 MHz
8 MHz
Supply Current-Max
45 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Gold (Au)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Length
82.042 mm
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.08 mm
Width
22.86 mm
Compare 5962-8946203MYC with alternatives
Compare HD68000P-8 with alternatives