5962-8944903QX
vs
MD8087-2/BQA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEL CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
DIP,
CERAMIC, DIP2-40
Pin Count
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
8 MHz
External Data Bus Width
16
16
JESD-30 Code
R-GDIP-T40
R-CDIP-T40
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535 Class Q
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-8944903QX with alternatives
Compare MD8087-2/BQA with alternatives