5962-8873908QX vs 5962-8873908QX feature comparison

5962-8873908QX QP Semiconductor

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5962-8873908QX LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-40 CERAMIC, DIP-40
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Boundary Scan NO NO
Clock Frequency-Max 22.22 MHz 22.22 MHz
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T40 R-GDIP-T40
Low Power Mode NO NO
Number of Terminals 40 40
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Data Bus Width 16 16
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 1 1

Compare 5962-8873908QX with alternatives

Compare 5962-8873908QX with alternatives