5962-8873503LX vs WS57C45-35S feature comparison

5962-8873503LX QP Semiconductor

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WS57C45-35S STMicroelectronics

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC STMICROELECTRONICS
Package Description DIP, 0.300 INCH, PLASTIC, DIP-24
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 15 ns
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Memory Density 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 2KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIP
Pin Count 24
I/O Type COMMON
JESD-609 Code e3
Length 32.005 mm
Moisture Sensitivity Level 1
Output Characteristics REGISTERED
Package Equivalence Code DIP24,.3
Programming Voltage 13.5 V
Seated Height-Max 4.32 mm
Standby Current-Max 0.02 A
Supply Current-Max 0.082 mA
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-8873503LX with alternatives

Compare WS57C45-35S with alternatives