5962-8873303YX vs LMA1010GC25 feature comparison

5962-8873303YX Integrated Device Technology Inc

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LMA1010GC25 LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC LOGIC DEVICES INC
Part Package Code LCC PGA
Package Description QCCN, PGA, PGA68,11X11
Pin Count 68 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Boundary Scan NO NO
External Data Bus Width 16 16
JESD-30 Code S-XQCC-N68 S-CPGA-P68
Low Power Mode NO YES
Number of Terminals 68 68
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Data Bus Width 35 35
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN PGA
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form NO LEAD PIN/PEG
Terminal Position QUAD PERPENDICULAR
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches 3 1
Rohs Code No
Clock Frequency-Max 40 MHz
JESD-609 Code e0
Length 29.4386 mm
Moisture Sensitivity Level 3
Package Equivalence Code PGA68,11X11
Peak Reflow Temperature (Cel) 225
Seated Height-Max 3.81 mm
Supply Current-Max 25 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 29.4386 mm

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