5962-8873303YX
vs
5962-8873301XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
LOGIC DEVICES INC
Part Package Code
LCC
DIP
Package Description
QCCN,
DIP,
Pin Count
68
64
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Boundary Scan
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-XQCC-N68
R-XDIP-T64
Low Power Mode
NO
NO
Number of Terminals
68
64
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Data Bus Width
35
35
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
QUAD
DUAL
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
3
3
Clock Frequency-Max
18.18 MHz
Seated Height-Max
5.72 mm
Terminal Pitch
2.54 mm
Width
22.86 mm
Compare 5962-8873303YX with alternatives
Compare 5962-8873301XX with alternatives