5962-8873302YC
vs
TMC2210J0V1
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LOGIC DEVICES INC
|
TRW INC
|
Part Package Code |
LCC
|
|
Package Description |
QCCN, LCC68,.95SQ
|
,
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
2 X 16 BIT DATA INPUT BUS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 15MHZ
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-CQCC-N68
|
R-CDIP-T64
|
JESD-609 Code |
e4
|
|
Length |
24.1935 mm
|
|
Low Power Mode |
NO
|
NO
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
68
|
64
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Data Bus Width |
35
|
35
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
|
Package Equivalence Code |
LCC68,.95SQ
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883
|
Seated Height-Max |
3.048 mm
|
|
Supply Current-Max |
25 mA
|
75 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
DUAL
|
Width |
24.1935 mm
|
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-8873302YC with alternatives
Compare TMC2210J0V1 with alternatives