5962-8873302YC
vs
TMC2210G8C1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
RAYTHEON SEMICONDUCTOR
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCN, LCC68,.95SQ
|
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-CQCC-N68
|
S-XPGA-P68
|
| JESD-609 Code |
e4
|
e0
|
| Length |
24.1935 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Data Bus Width |
35
|
35
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
QCCN
|
PGA
|
| Package Equivalence Code |
LCC68,.95SQ
|
PGA68,11X11
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
3.048 mm
|
|
| Supply Current-Max |
25 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
24.1935 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
| Base Number Matches |
1
|
2
|
|
|
|
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