5962-8873302XC
vs
5962-8873302XX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-609 Code |
e4
|
|
| Length |
81.28 mm
|
|
| Low Power Mode |
NO
|
NO
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Data Bus Width |
35
|
35
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIP
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.81 mm
|
5.72 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
22.86 mm
|
22.86 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
| Base Number Matches |
2
|
3
|
| JESD-30 Code |
|
R-XDIP-T64
|
| Number of Terminals |
|
64
|
| Package Shape |
|
RECTANGULAR
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 5962-8873302XC with alternatives
Compare 5962-8873302XX with alternatives