5962-8873302XC
vs
5962-8873301YX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
LCC
|
Package Description |
DIP,
|
QCCN,
|
Pin Count |
64
|
68
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-609 Code |
e4
|
|
Length |
81.28 mm
|
|
Low Power Mode |
NO
|
NO
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Data Bus Width |
35
|
35
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
DIP
|
QCCN
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.81 mm
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Width |
22.86 mm
|
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
Base Number Matches |
2
|
3
|
JESD-30 Code |
|
S-XQCC-N68
|
Number of Terminals |
|
68
|
Package Shape |
|
SQUARE
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 5962-8873302XC with alternatives
Compare 5962-8873301YX with alternatives