5962-8872401LX
vs
PALC22V10-25WMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
INTEL CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
CERAMIC, DIP-24
0.300 INCH, WINDOWED, CERDIP-24
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
30.3 MHz
30.3 MHz
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
32 mm
31.877 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Programmable Logic Type
UV PLD
UV PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
6
3
Rohs Code
Part Package Code
DIP
Pin Count
24
Additional Feature
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
Architecture
PAL-TYPE
JESD-609 Code
e0
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Package Equivalence Code
DIP24,.3
Terminal Finish
TIN LEAD
Compare 5962-8872401LX with alternatives
Compare PALC22V10-25WMB with alternatives