5962-8867001LC vs PALC22V10-25WMB feature comparison

5962-8867001LC Cypress Semiconductor

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PALC22V10-25WMB AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
Clock Frequency-Max 30.3 MHz
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Number of Dedicated Inputs 11
Number of I/O Lines 10
Number of Terminals 24
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Programmable Logic Type OT PLD UV PLD
Propagation Delay 25 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 2 3

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Compare PALC22V10-25WMB with alternatives