5962-8866906YX vs 5962-8866906ZX feature comparison

5962-8866906YX Integrated Device Technology Inc

Buy Now Datasheet

5962-8866906ZX Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP QFJ
Package Description DIP, QCCN,
Pin Count 28 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns 20 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 30 ns 30 ns
JESD-30 Code R-GDIP-T28 R-CQCC-N32
Length 37.1475 mm 13.97 mm
Memory Density 18432 bit 18432 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX9 2KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.08 mm 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 11.43 mm
Base Number Matches 1 1

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