5962-8866906ZX
vs
7203L20LGB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QCCN,
QCCN,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
20 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
30 ns
30 ns
JESD-30 Code
R-CQCC-N32
S-XQCC-N32
Length
13.97 mm
Memory Density
18432 bit
18432 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
Base Number Matches
5
1
Pbfree Code
Rohs Code
Part Package Code
QFJ
Pin Count
32
Clock Frequency-Max (fCLK)
33.3 MHz
JESD-609 Code
e3
Memory IC Type
OTHER FIFO
Output Characteristics
3-STATE
Screening Level
MIL-STD-883 Class B
Standby Current-Max
0.004 A
Supply Current-Max
0.15 mA
Terminal Finish
MATTE TIN
Compare 5962-8866906ZX with alternatives
Compare 7203L20LGB with alternatives