5962-8866903XX
vs
5962-8956704XA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TEMIC SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP28,.6
0.300 INCH, THIN, CERAMIC, DIP-28
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
50 ns
50 ns
Clock Frequency-Max (fCLK)
15.4 MHz
Cycle Time
65 ns
65 ns
JESD-30 Code
R-GDIP-T28
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.025 A
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Additional Feature
RETRANSMIT
JESD-609 Code
e0
Length
37.1475 mm
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Width
7.62 mm
Compare 5962-8866903XX with alternatives
Compare 5962-8956704XA with alternatives