5962-8866903XX
vs
SN74ACT7203L50NP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
37.1475 mm
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
2KX9
2KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
7
2
Pbfree Code
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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