5962-8866509ZA
vs
5962-8866512ZA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
QP SEMICONDUCTOR INC
DEFENSE LOGISTICS AGENCY
Part Package Code
PGA
Package Description
CAVITY-UP, CERAMIC, PGA-68
CAVITY-UP, CERAMIC, PGA-68
Pin Count
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
70 ns
55 ns
Additional Feature
ARBITER
JESD-609 Code
e0
e0
Length
29.464 mm
29.464 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX16
2KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Qualified
Seated Height-Max
5.207 mm
5.207 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
29.464 mm
29.464 mm
Base Number Matches
5
3
Compare 5962-8866509ZA with alternatives
Compare 5962-8866512ZA with alternatives