5962-8866512ZA
vs
7006S55PF9
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
CAVITY-UP, CERAMIC, PGA-68
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Reach Compliance Code
unknown
compliant
Access Time-Max
55 ns
55 ns
JESD-609 Code
e0
e0
Length
29.464 mm
14 mm
Memory Density
32768 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
8
Number of Functions
1
1
Number of Words
2048 words
16384 words
Number of Words Code
2000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
2KX16
16KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
LQFP
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Not Qualified
Seated Height-Max
5.207 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
PERPENDICULAR
QUAD
Width
29.464 mm
14 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
64
ECCN Code
EAR99
HTS Code
8542.32.00.41
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 Code
S-PQFP-G64
Moisture Sensitivity Level
3
Number of Terminals
64
Package Shape
SQUARE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-8866512ZA with alternatives
Compare 7006S55PF9 with alternatives