5962-8866202MX
vs
5962-8855209NX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DFP
DFP
Package Description
DFP,
DFP,
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
45 ns
JESD-30 Code
R-GDFP-F28
R-GDFP-F28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Compare 5962-8866202MX with alternatives
Compare 5962-8855209NX with alternatives