5962-8863605KX
vs
MB7132-EWCF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
DFP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
12 ns
|
55 ns
|
| JESD-30 Code |
R-GDFP-F24
|
R-CDFP-F24
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
1KX8
|
1KX8
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Length |
|
15.24 mm
|
| Seated Height-Max |
|
2.54 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
10.16 mm
|
|
|
|
Compare 5962-8863605KX with alternatives
Compare MB7132-EWCF with alternatives