5962-8855213MA
vs
5962-9461114HMX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCN,
|
CERAMIC, QFP-68
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
12 ns
|
25 ns
|
| JESD-30 Code |
R-CQCC-N28
|
S-CQFP-G68
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
262144 bit
|
16777216 bit
|
| Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
| Memory Width |
8
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
68
|
| Number of Words |
32768 words
|
524288 words
|
| Number of Words Code |
32000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
32KX8
|
512KX32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
4
|
5
|
| Length |
|
22.352 mm
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
5.08 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
22.352 mm
|
|
|
|
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