5962-8855213MA
vs
DPS32M8AGL-55B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
TWILIGHT TECHNOLOGY INC
Package Description
LCC-28
QCCN, LCC32,.45X.55
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
55 ns
JESD-30 Code
R-CQCC-N28
R-CQCC-N32
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Position
QUAD
QUAD
Base Number Matches
4
2
Pbfree Code
Rohs Code
Part Package Code
QFJ
Pin Count
32
I/O Type
COMMON
Length
13.97 mm
Output Characteristics
3-STATE
Package Equivalence Code
LCC32,.45X.55
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
2.159 mm
Standby Current-Max
0.0006 A
Standby Voltage-Min
2 V
Supply Current-Max
0.16 mA
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
Compare 5962-8855213MA with alternatives