5962-8852503YX
vs
AT28C256-25LM/883-815
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XICOR INC
MICROCHIP TECHNOLOGY INC
Package Description
QCCN,
LCC-32
Reach Compliance Code
unknown
compliant
Access Time-Max
250 ns
250 ns
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class C
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Position
QUAD
QUAD
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
5
1
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Factory Lead Time
23 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
AUTOMATIC WRITE
Length
13.97 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
2.54 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
Compare 5962-8852503YX with alternatives
Compare AT28C256-25LM/883-815 with alternatives